product specifications matsushita electronics corporation fmsc-psda-002-01 preparedchecked approved eff. date eff. date eff. date eff. date AN7523N ref no. total page page no. a-1 91 operating supply voltage range vcc 3.5v ~ 13.5v absolute maximum ratings a 12 3 4 5 6 7 8 no. item storage temperature operating ambient temperature operating ambient pressure operating constant acceleration operating shock supply voltage supply currentpower dissipation symbol tstg topr popr gopr sopr vcc icc pd ratings -55 ~ +150 -25 ~ +70 14.4 1.0 1.22 unit c c va w note the temperature of all items shall be ta=25 c except storage temperature andoperating ambient temperature. at no signal input. 11 ta=70 c note 1) 2) 2 25-apr-2000 1.013x1050.61x105 (1.00.6) pa (atm) 9,810 (1000) m/s2 (g) 4,900 (500) m/s2 (g) structureappearance application function silicon monolithic bipolar ic sil-9 pin plastic package (power type with fin) low frequency amplifier btl 4.0w x 1ch power amplifier with standby function and volume function 21-jul-2000
output offset voltage product specifications matsushita electronics corporation fmsc-psda-002-01 preparedchecked approved eff. date eff. date eff. date eff. date AN7523N ref no. total page page no. b-1 92 electrical characteristics b 12 3 4 5 6 7 8 9 10 11 no item quiescent circuitcurrent symbol test cir- cuit conditions vin=0v, vol=0v note total harmonic distortion unit max typ min limits (unless otherwise specified, the ambient temperature is 25c2?c, vcc=8.0v, frequency=1khz and r l=8w.) icq thd voltage gain po=0.5w, vol=1.25v rg=10kw , vol=0v output noise voltage maximum poweroutput 1 ripple rejectionratio standby current volume attenuation ratio middle voltage gain istb vno gv rr po1 voff att gvm 11 1 1 1 1 1 1 1 1 1 vin=0v, vol=0v po=0.5w, vol=1.25v thd=10%, vol=1.25v rg=10kw , vol=0v vr=0.5vrms, fr=120hz rg=10kw , vol=0v po=0.5w, vol=0v po=0.5w, vol=0.6v -- - 31 - 2.43.2 30 -250 70 20.5 20 1 0.10 33 0.10 3.04.0 50 0 85 23.5 6010 0.4 35 0.5 -- - 250 - 26.5 ma ma mvrms db % ww db mv dbdb 1 1 1 25-apr-2000 maximum poweroutput 2 po2 vcc=9v thd=10%, vol=1.25v note 1) for this measurement, use the bpf = 15hz ~ 30khz (12db/oct). 21-jul-2000
product specifications matsushita electronics corporation fmsc-psda-002-01 preparedchecked approved eff. date eff. date eff. date eff. date AN7523N ref no. total page page no. b-2 93 electrical characteristics b 12 3 no item standby pincurrent symbol test cir- cuit conditions vin=0v, vol=0v note unit max typ min limits (unless otherwise specified, the ambient temperature is 25c2c, vcc=8.0v, frequency=1khz and r l=8w.) istb2 note) ivol 11 1 vin=0v, v stb=3v - -12 24 -- 30 25 - 36 mam a kw (reference data for design) volume pin current the above characteristics are reference values determined for ic design, but not guaranteed values for shipping inspection. if problems were to occur, counter measures will be sincerely discussed. 25-apr-2000 input impedance zi vin= 0.3vdc 21-jul-2000
product specifications matsushita electronics corporation fmsc-psda-002-01 preparedchecked approved eff. date eff. date eff. date eff. date AN7523N ref no. total page page no. c-1 94 (description of test circuit and test method) test circuit 1 note) if the standby pin is open or 0v, the ic is on standby state. the ic is in the state of volume minimum if the volume pin is ground. the ic is in the state of volume maximum if the volume pin is open. 1 2 8 7 AN7523N 10m out1 8w 9 1.25v vcc 470m + + 68k 270k vin 1.0m 10k + stand-by 5v 0v volume 0v 6 5 3 4 25-apr-2000 21-jul-2000
product specifications matsushita electronics corporation fmsc-psda-002-01 preparedchecked approved eff. date eff. date eff. date eff. date AN7523N ref no. total page page no. d-1 95 circuit function block diagram pin descriptions 12 3 4 5 6 7 8 9 vccch output (+) gnd (output) ch output (-) standby ch input gnd (input) n.c volume pin no. description vcc + _ + _ inputgnd output gnd 3 1 2 4 8 7 6 5 9 note) do not apply voltage or current to nc pin from outside. 25-apr-2000 21-jul-2000
product specifications matsushita electronics corporation fmsc-psda-002-01 preparedchecked approved eff. date eff. date eff. date eff. date ref no. total page page no. e 96 package name unit : mm f - 9s company insignia date code name of item 1.70.25 +0.1-0.05 0.44 2.54 1 2 3 4 6 7 8 9 1.20.25 3.750.25 7.10.25 6.30.3 8.40.25 0.50.1 5.60.25 0.15 max f3.30.1 5.80.25 1.50.25 21.60.3 1.70.25 f2.650.1 25-apr-2000 AN7523N 21-jul-2000 19.920.3 18.50.25 15.0 5
product specifications matsushita electronics corporation fmsc-psda-002-01 preparedchecked approved eff. date eff. date eff. date eff. date ref no. total page page no. f-1 97 (structure description) package 9-sip(f) chip surface passivationlead frame material inner lead surface process outer lead surface process chip mounting method wire bonding method wire material, diameter mold materialmolding method sin,fe group, ag plating, solder plating, ag paste, thermalsonic bonding, au, epoxy, transfer mold, others ( )others ( ) others ( ) others ( ) others ( ) others ( ) others ( ) others ( ) others ( ) 1 2 , 6 psg,cu group, au plating, solder dip, au-si alloy, solder, diameter 30 mm multiplunger mold, 2 6 3 4 4 5 5 1 3 2 4 6 5 25-apr-2000 AN7523N 21-jul-2000
product specifications matsushita electronics corporation fmsc-psda-002-01 preparedchecked approved eff. date eff. date eff. date eff. date ref no. total page page no. g 98 (technical data) ambient temperature, ta ( c) power dissipation, pd (mw) 0 25 50 75 100 125 150 0 pd - ta f-9s package power dissipation 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 25-apr-2000 AN7523N rth(j-c) = 12.0c/w rth(j-a) = 66.5c/w ( ) 70 4706 3636 1203 21-jul-2000 without heat sink p d=1880mw(25c) 5 c/w heat sink 10 c/w heat sink 20 c/w heat sink without heat sink
product specifications matsushita electronics corporation fmsc-psda-002-01 preparedchecked approved eff. date eff. date eff. date eff. date AN7523N ref no. total page page no. h 99 (precautions for use) 1) make sure that the ic is free of any pin short-circuiting, ground short, and load short- circuiting. 2) ground the radiation fin so that there will be no difference in electric potential between the radiation fin and ground. 3) the thermal protection circuit operates at a tj of approximately 150 c. the thermal protection circuit is reset automatically when the temperature drops. 4) make sure that the heat radiation design is effective enough if the vcc is comparatively high or the ic operates high output power. 5) connect only ground pin for signal sources to the signal gnd pin of the amplifier on the previous stage. 6) the electric surge voltage for this ic low, therefore be extra careful when using the following pin (at 200pf): pin 6=+180v, pin 9=+100v 25-apr-2000 21-jul-2000
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